This blog is to share the latest research and development of acupuncture and raise the awareness of alternative treatments for your conditions, and is for information only.

Wednesday, 18 March 2015

Acupuncture significantly reduced pain associated with scar tissue

Manual acupuncture treatment significantly relived pain associated with scar tissue, a case report published in the Journal of Acupuncture and Meridian Studies.

Scar tissue usually forms after deep trauma, such as burns and surgery to the dermis. Excessive scar also known as hypertrophic scar are benign fibrotic proliferation due to the overproliferation of fibroblasts. Current treatments include intralesional corticosteroid injection, radiotherapy and surgical manipulation which are associated with adverse effects.

Dr. Sheng Fang in the United State treated a female patient with a surgical scar on the upper right thigh for a year and wrote a case report. The scar was about 3 inches long, 1/4 inch wide, red colour, tough, and hard. It was very sensitive to touch. Patient mentioned she felt a stabling pain in the scar area for 3 months. The pain intensity level was 7 on the Likert Scale of 0-10 (0 being no pain and 10 being the worst pain). Acupuncture treatment consisted of Wei Ci points in the local scar area (8 needles) plus bilateral LI4, LIV3 and ST36 acupoints. Treatments lasted 20 mins each time, twice a week for 3 weeks. After second treatment patient reported a decreased pain associated with scar. At the end of 3 week treatment patient only occasionally pain. The pain intensity level dropped to 1-2 on a scale of 0-10. Then treatment was once a week for further two weeks. Patient felt the pain maintained at the similar level as the third week treatment. No further follow-up was carried out.

The case report suggests that acupuncture markedly reduced pain associated with scar tissue.

Reference:
Fang S, The successful treatment of pain associated with scar tissue.  J Acupunct Meridian Stud 2014;7(5):262-264.   http://www.jams-kpi.com/article/S2005-2901(14)00092-2/abstract

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